The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 11, 2011
Filed:
Sep. 30, 2008
Ahmet Gun Erlat, Clifton Park, NY (US);
George Theodore Dalakos, Niskayana, NY (US);
Min Yan, Ballston Lake, NY (US);
Shelia Neumann Tandon, Niskayuna, NY (US);
Brian Joseph Scherer, Niskayuna, NY (US);
Ahmet Gun Erlat, Clifton Park, NY (US);
George Theodore Dalakos, Niskayana, NY (US);
Min Yan, Ballston Lake, NY (US);
Shelia Neumann Tandon, Niskayuna, NY (US);
Brian Joseph Scherer, Niskayuna, NY (US);
General Electric Company, Schenectady, NY (US);
Abstract
In a method for depositing a barrier coating, a device is provided comprising a first portion and a second portion where a surface of the second portion is in a shadow zone. The device is pretreated wherein the pretreating alters a deposition rate of the barrier coating on a surface exposed to the pretreating. The shadow zone is substantially unexposed to the pretreating. A barrier coating is deposited wherein the barrier coating substantially conforms to a profile of the device. The coating may be a graded-composition barrier coating wherein a composition of the coating varies substantially continuously across a thickness thereof. The first portion may include a flexible, substantially transparent substrate. The second portion may include an electronic device. The barrier coating and first portion may encapsulate the second portion. The method is a single, commercially advantageous, barrier deposition process, enabling increased product throughput and low process tact time.