The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 11, 2011

Filed:

Dec. 18, 2009
Applicants:

Robert Neil Mulfinger, York Haven, PA (US);

Jason M'cheyne Reisinger, Carlisle, PA (US);

Richard Elof Hamner, Hummelstown, PA (US);

Steven J. Millard, Mechanicsburg, PA (US);

Inventors:

Robert Neil Mulfinger, York Haven, PA (US);

Jason M'Cheyne Reisinger, Carlisle, PA (US);

Richard Elof Hamner, Hummelstown, PA (US);

Steven J. Millard, Mechanicsburg, PA (US);

Assignee:

Tyco Electronics Corporation, Berwyn, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/00 (2006.01); H05K 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An interconnect assembly for interconnecting first and second electrical components includes a substrate having opposed first and second surfaces and a first array of contacts on the first surface for engaging corresponding elements on the first electrical component. The first array of contacts defines a compressible interface that mates with the first electrical component. The first array of contacts includes signal contacts transferring data signals across the compressible interface and the first array of contacts includes a combination of power contacts that jointly convey power across the compressible interface. The interconnect assembly also includes a second array of contacts on the second surface for engaging corresponding elements on the second electrical component. The second array of contacts having signal contacts electrically connected to the signal contact of the first array of contacts and power contacts electrically connected to the power contacts of the second array of contacts.


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