The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 11, 2011

Filed:

May. 15, 2009
Applicants:

Samuel Chen, Penfield, NY (US);

Stephen C. Stoker, Rochester, NY (US);

Giana M. Phelan, Rochester, NY (US);

Inventors:

Samuel Chen, Penfield, NY (US);

Stephen C. Stoker, Rochester, NY (US);

Giana M. Phelan, Rochester, NY (US);

Assignee:

Eastman Kodak Company, Rochester, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/135 (2006.01);
U.S. Cl.
CPC ...
Abstract

A recyclable continuous ink jet print head is provided that includes a manifold formed from a metal such as stainless steel, a die having ink jet nozzles formed from a ceramic material such as silicon, a control circuit connected to the die via microwiring, and an interposing member disposed between the manifold and the die. The interposing member is formed from a composite material such as Al—SiC having a coefficient of thermal conductivity that is higher than that of the silicon die, and a coefficient of thermal expansion (CTE) that is between that of the die and the manifold. During manufacture, the CTE value of the interposing member allows long-lasting, heat-cured epoxy compositions to be used to bond the die to the manifold and to encapsulate the microwiring between the die and a control circuit with while maintaining proper alignment of the die ink jet nozzles on the manifold. When the die wears out, the high thermal conductivity of the interposing member allows the die to be easily removed from the manifold, thereby facilitating re-cycling of the manifold.


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