The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 11, 2011
Filed:
Sep. 12, 2008
Hea-woong Lee, Gyeongg-do, KR;
Chang-gil Ryu, Gyeonggi-do, KR;
Byoung-moon Yoon, Gyeonggi-do, KR;
Yong-myung Jun, Gyeonggi-do, KR;
Kang-hee Han, Seoul, KR;
Hea-Woong Lee, Gyeongg-do, KR;
Chang-Gil Ryu, Gyeonggi-do, KR;
Byoung-Moon Yoon, Gyeonggi-do, KR;
Yong-Myung Jun, Gyeonggi-do, KR;
Kang-Hee Han, Seoul, KR;
Samsung Electronics Co., Ltd., Suwon-Si, KR;
Abstract
A wafer guide for preventing a wafer breakage in a semiconductor cleaning apparatus includes a lower supporter, side supporters, fixing units and stoppers. The lower supporter is provided with a plurality of slots formed with the same interval in a length direction to vertically stand a plurality of wafers thereon. The side supporters are structured and arranged in parallel at each side above the lower supporter. The side supporters support side end parts of the wafers. The fixing units are adapted to support both end parts of the lower supporter and the side supporters, and may be fixed to a bath. The stoppers are individually coupled to each of the fixing units. The stoppers are operable to generate an error in a close operation of holder units of the robot chuck when the robot chuck deviates from a normal alignment range, so as not to perform a wafer chucking, thereby preventing a wafer breakage during the wafer chucking.