The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 11, 2011
Filed:
Oct. 03, 2006
Keiichi Sasamura, Kawasaki, JP;
Kenichi Yazaki, Kawasaki, JP;
Yuuzou Hamanaka, Kawasaki, JP;
Yukio Ando, Kawasaki, JP;
Hideyasu Hashiba, Kawasaki, JP;
Keiichi Sasamura, Kawasaki, JP;
Kenichi Yazaki, Kawasaki, JP;
Yuuzou Hamanaka, Kawasaki, JP;
Yukio Ando, Kawasaki, JP;
Hideyasu Hashiba, Kawasaki, JP;
Fujitsu Semiconductor Limited, Yokohama, JP;
Abstract
The present invention provides a cover tape for packaging a semiconductor device which protects the outer shape of the semiconductor device, and is capable of improving the mounting speed of the semiconductor device by shipment in tape, and a package for the semiconductor device using the cover tape for packaging the semiconductor device. The cover tape for packaging the semiconductor device has a net-shaped structure at least in a portion, and the cover tape for packaging the semiconductor device is pasted onto an embossed tape which has a number of pockets containing semiconductor devices. The package for the semiconductor device contains an embossed tape which has a number of pockets which contain semiconductor devices, and the cover tape for packaging the semiconductor device.