The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 11, 2011
Filed:
Nov. 13, 2006
Masato Kitajima, Hekinan, JP;
Kunihiko Unno, Hamamatsu, JP;
Hiroshi Takehara, Kasugai, JP;
Takuma Kono, Okazaki, JP;
Shinji Soma, Handa, JP;
Masato Kitajima, Hekinan, JP;
Kunihiko Unno, Hamamatsu, JP;
Hiroshi Takehara, Kasugai, JP;
Takuma Kono, Okazaki, JP;
Shinji Soma, Handa, JP;
Toyoda Van Moppes Ltd., Okazaki-shi, JP;
JTEKT Corporation, Osaka-shi, JP;
Abstract
A plurality of segmented chips are reinforced by applying an adhesive to the circumferentially opposite end portions thereof, and the adjoining segmented chips adjoining in the circumferential direction are adhered to the circumferential surface of a disc-like core with the adhesives at the circumferentially opposite end portions being not jointed with each other. Thus, the segmented chips can be prevented from being loaded with an unnatural force even when the disc-like core with the segmented chips adhered thereto expands and contracts radially due to thermal expansion and thermal contract. Thereby, expansion and contraction of the disc-like core do not impose a compression stress or the like on adhesives situated between adjoining segmented chips.