The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 11, 2011
Filed:
Aug. 23, 2007
Nariaki Kuriyama, Saitama, JP;
Jun Sasahara, Saitama, JP;
Tadahiro Kubota, Saitama, JP;
Daisuke Okamura, Saitama, JP;
Takeshi Ohsato, Saitama, JP;
Nariaki Kuriyama, Saitama, JP;
Jun Sasahara, Saitama, JP;
Tadahiro Kubota, Saitama, JP;
Daisuke Okamura, Saitama, JP;
Takeshi Ohsato, Saitama, JP;
Honda Motor Co., Ltd, Tokyo, JP;
Abstract
There is provided a method for producing a force sensor including: a force sensor chip; and an attenuator, in which the force sensor chip and the attenuator are joined at joint portions with a glass layer sandwiched therebetween. The method includes: a film forming step in which a glass film as the glass layer is formed on regions of the attenuator containing the joint portions or on regions of the force sensor chip containing the joint portions; and an anodic bonding step in which the force sensor chip and the attenuator are stacked as a stacked body in close contact with each other at the joint portions, and the glass film and the force sensor chip, or the glass film and the attenuator, are joined.