The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 2011
Filed:
Jun. 16, 2006
Applicants:
Huili Fu, Hong Kong, CN;
Man Lung Sham, Hong Kong, CN;
Chang-hwa Chung, Hong Kong, CN;
Inventors:
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/02 (2006.01); H05K 7/04 (2006.01);
U.S. Cl.
CPC ...
Abstract
An IC package includes a substrate and a plurality of thermal dissipating vias perforating the substrate. The substrate includes a power plane, a ground plane, and a dielectric layer disposed between the power plane and the ground plane. The power plane includes a power region and a non-power region isolated from each other. The thermal dissipating vias are connected to the non-power regions of the power plane and to the ground plane.
Fu, Huili. (2011). Ic packages with internal heat dissipation structures (U.S. Patent No. 8031484). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8031484
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile