The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 04, 2011

Filed:

May. 27, 2009
Applicants:

Michael J. Nelson, Prior Lake, MN (US);

Michael J. Wayman, Waconia, MN (US);

Inventors:

Michael J. Nelson, Prior Lake, MN (US);

Michael J. Wayman, Waconia, MN (US);

Assignee:

ADC Telecommunications, Inc., Eden Prairie, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for thermal management is provided. The method includes providing thermal isolation between at least one high-power thermally tolerant electronic component and at least one low-power thermally sensitive electronic component housed within an electrical enclosure, providing a first conductive path from the at least one low-power electronic component to a first heatsink, providing a second conductive path from the at least one high-power electronic component to a second heatsink, dissipating heat generated by the at least one low-power thermally sensitive electronic component and dissipating heat generated by the at least one high-power thermally tolerant electronic component to an environment external to the electrical enclosure by channeling the heat generated by the at least one low-power thermally sensitive electronic component and the at least one high-power thermally tolerant electronic component along the first and second conductive path, respectively. The first and second conductive paths are independent from each other.


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