The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 2011
Filed:
Oct. 15, 2009
Fujio Kobayashi, Kanagawa, JP;
Masashi Torimoto, Saitama, JP;
Shizuo Arai, Kanagawa, JP;
Katsuharu Kajikawa, Tokyo, JP;
Fujio Kobayashi, Kanagawa, JP;
Masashi Torimoto, Saitama, JP;
Shizuo Arai, Kanagawa, JP;
Katsuharu Kajikawa, Tokyo, JP;
Sony Corporation, Tokyo, JP;
Abstract
A molded component includes: a primary molded layer including a boxlike base portion that has a width direction in a first direction, a length direction in a second direction, and a height direction in a third direction and includes a first surface protruding in the third direction and a second surface that forms a spatial portion on the other side of the first surface, and a pedestal portion protruding outwardly in parallel to the first direction and the second direction from a circumferential edge of the base portion; a secondary molded layer formed of an optically-transparent resin material, that is laminated on the primary molded layer and has the same width and length as the primary molded layer; and an in-mold layer formed between the primary molded layer and the secondary molded layer.