The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 2011
Filed:
Jun. 26, 2008
Manuel F. Romero, Chandler, AZ (US);
Peter H. Aaen, Phoenix, AZ (US);
Manuel F. Romero, Chandler, AZ (US);
Peter H. Aaen, Phoenix, AZ (US);
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
A semiconductor package () includes circuits (). The circuit () includes electrical devices () interconnected by a bondwire array (). Likewise, the circuit () includes electrical devices () interconnected by a bondwire array (). Signal wires () of the bondwire array () are proximate to signal wires () of the bondwire array (). Ground wires () are located on either side of, and close to, bondwire array (). Ground wires () are located on either side of, and close to, bondwire array (). The ground wires () are electrically coupled to a ground region (). The ground wires () reduce a magnetic flux density () via induced return currents () on the ground wires of opposite polarity to signal currents () on the bondwire arrays () to reduce inductive coupling between the adjacent bondwire arrays ().