The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 2011
Filed:
Dec. 04, 2007
Applicants:
Keiji Toh, Kariya, JP;
Hidehito Kubo, Kariya, JP;
Masahiko Kimbara, Okazaki, JP;
Haruo Takagi, Kariya, JP;
Daizo Kamiyama, Kariya, JP;
Inventors:
Keiji Toh, Kariya, JP;
Hidehito Kubo, Kariya, JP;
Masahiko Kimbara, Okazaki, JP;
Haruo Takagi, Kariya, JP;
Daizo Kamiyama, Kariya, JP;
Assignee:
Kabushiki Kaisha Toyota Jidoshokki, Aichi-ken, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 21/58 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor apparatus includes a semiconductor device, a cooler of a forced cooling type, and a heat mass. Heat generated in the semiconductor device is conducted to the cooler. The heat mass comes into junction with the semiconductor device with solder so as to be thermally combined with the semiconductor device. The heat mass functions also as an electrode.