The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 2011
Filed:
Sep. 13, 2007
Applicant:
Makoto Kitabatake, Nara, JP;
Inventor:
Makoto Kitabatake, Nara, JP;
Assignee:
Panasonic Corporation, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/10 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor module () includes a heat sink (), an electronic component (), a semiconductor device (), and a thermally-conductive sheet member (). The thermally-conductive sheet member () covers a part of the semiconductor device () and has a lower part () and a side part (). The lower part () is in contact with a mounting face () of the heat sink (). The side part () extends from the lower part () and covers a first side surface () of the semiconductor device (). The electronic component () is disposed across the side part () of the thermally-conductive sheet member () from the semiconductor device ().