The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 2011
Filed:
Jan. 31, 2007
Applicants:
Peter G. Hartwell, Palo Alto, CA (US);
Duncan Stewart, Palo Alto, CA (US);
Inventors:
Peter G. Hartwell, Palo Alto, CA (US);
Duncan Stewart, Palo Alto, CA (US);
Assignee:
Hewlett-Packard Development Company, L.P., Houston, TX (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/15 (2006.01); H01L 23/06 (2006.01);
U.S. Cl.
CPC ...
Abstract
One embodiment in accordance with the invention is a system that can include a first wafer and a second wafer. The first wafer and the second wafer can be bonded together by a wafer bonding process that forms a gap between the first wafer and the second wafer. The gap can be configured for receiving a heat extracting material.
Quick Actions:
Hartwell, Peter. (2011). Chip cooling channels formed in wafer bonding gap (U.S. Patent No. 8030754). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8030754
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile