The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 2011
Filed:
Feb. 08, 2008
Applicant:
Chip King Tan, Perak, MY;
Inventor:
Chip King Tan, Perak, MY;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
An integrated circuit package includes a substrate and a first semiconductor chip. The first semiconductor chip is provided in a cavity on a first side of the substrate. The package further includes a second semiconductor chip provided on a second side of the substrate. The first semiconductor chip and the second semiconductor chip form a stack.
Tan, Chip. (2011). Integrated circuit package (U.S. Patent No. 8030746). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8030746
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile