The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8030730 B1

PDF
Full Text
Expired
Date of Patent:
Oct. 04, 2011

Filed:

Mar. 11, 2009
Applicants:

Tetsuya Nitta, Hyogo, JP;

Takayuki Igarashi, Hyogo, JP;

Inventors:

Tetsuya Nitta, Hyogo, JP;

Takayuki Igarashi, Hyogo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An N-layer is formed on a semiconductor substrate, with a BOX layer interposed. In the N-layer, a trench isolation region is formed to surround the N-layer to be an element forming region. The trench isolation region is formed to reach the BOX layer, from the surface of the N-layer. Between trench isolation region and the N-layer, a P type diffusion regionis formed. The P type diffusion region is formed continuously without any interruption, to be in contact with the entire surface of an inner sidewall of the trench isolation region surrounding the element forming region. In the element forming region of the N-layer, a prescribed semiconductor element is formed. Thus, a semiconductor device is formed, in which electrical isolation is established reliably, without increasing the area occupied by the element forming region.


Find Patent Forward Citations

Nitta, Tetsuya. (2011). Semiconductor device and manufacturing method thereof (U.S. Patent No. 8030730). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8030730

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