The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 2011
Filed:
Aug. 22, 2007
Morimitsu Sekimoto, Kusatsu, JP;
Hitoshi Haga, Sendai, JP;
Kenichi Sakakibara, Kusatsu, JP;
Reiji Kawashima, Kusatsu, JP;
Abdallah Mechi, Kusatsu, JP;
Toshiyuki Maeda, Kusatsu, JP;
Morimitsu Sekimoto, Kusatsu, JP;
Hitoshi Haga, Sendai, JP;
Kenichi Sakakibara, Kusatsu, JP;
Reiji Kawashima, Kusatsu, JP;
Abdallah Mechi, Kusatsu, JP;
Toshiyuki Maeda, Kusatsu, JP;
Daikin Industries, Ltd., Osaka, JP;
Abstract
In the case where a chip is made of wide band gap semiconductor, a power conversion apparatus is obtained in which a component having a low heat resistant temperature is prevented from receiving thermal damage by heat generated at the chip. In a configuration including: a chip portion () including a chip () made of wide band gap semiconductor and a member () having a heat resistant temperature equal to or higher than that of the chip (); and a peripheral component () arranged in the vicinity of the chip portion () and having a heat resistant temperature lower than that of the chip (). The chip () and the peripheral component () are thermally insulated from each other so that the temperature of the peripheral component () does not exceed the heat resistant temperature of the peripheral component ().