The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8030113 B1

PDF
Full Text
Expired
Date of Patent:
Oct. 04, 2011

Filed:

Jan. 06, 2011
Applicants:

Louis Lu-chen Hsu, Fishkill, NY (US);

Ping-chuan Wang, Hopewell Jct., NY (US);

Xiaojin Wei, Poughkeepsie, NY (US);

Huilong Zhu, Poughkeepsie, NY (US);

Inventors:

Louis Lu-Chen Hsu, Fishkill, NY (US);

Ping-Chuan Wang, Hopewell Jct., NY (US);

Xiaojin Wei, Poughkeepsie, NY (US);

Huilong Zhu, Poughkeepsie, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/34 (2006.01); H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

The invention comprises a 3D chip stack with an intervening thermoelectric coupling (TEC) plate. Through silicon vias in the 3D chip stack transfer electronic signals among the chips in the 3D stack, power the TEC plate, as well as distribute heat in the stack from hotter chips to cooler chips.


Find Patent Forward Citations

Hsu, Louis Lu-Chen. (2011). Thermoelectric 3d cooling (U.S. Patent No. 8030113). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8030113

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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