The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 2011
Filed:
Jan. 06, 2011
Applicants:
Louis Lu-chen Hsu, Fishkill, NY (US);
Ping-chuan Wang, Hopewell Jct., NY (US);
Xiaojin Wei, Poughkeepsie, NY (US);
Huilong Zhu, Poughkeepsie, NY (US);
Inventors:
Louis Lu-Chen Hsu, Fishkill, NY (US);
Ping-Chuan Wang, Hopewell Jct., NY (US);
Xiaojin Wei, Poughkeepsie, NY (US);
Huilong Zhu, Poughkeepsie, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/34 (2006.01); H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
The invention comprises a 3D chip stack with an intervening thermoelectric coupling (TEC) plate. Through silicon vias in the 3D chip stack transfer electronic signals among the chips in the 3D stack, power the TEC plate, as well as distribute heat in the stack from hotter chips to cooler chips.