The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 04, 2011

Filed:

Nov. 04, 2005
Applicants:

Kevin J. Surace, Sunnyvale, CA (US);

Brandon D. Tinianov, Santa Clara, CA (US);

Marc U. Porat, Beverly Hills, CA (US);

Inventors:

Kevin J. Surace, Sunnyvale, CA (US);

Brandon D. Tinianov, Santa Clara, CA (US);

Marc U. Porat, Beverly Hills, CA (US);

Assignee:

Serious Energy, Inc., Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/06 (2006.01); B32B 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

An improved radio frequency wave attenuating wall (ceiling or floor) or door material comprises a laminated structure having as an integral part thereof one or more layers of a viscoelastic material which also functions as a glue and one or more electrically conducting layers. An electrically conducting material such as tape or a formed metal channel provides an electrical connection between the electrically conducting material and an exposed outer surface of the laminated structure. In one embodiment the electrically conducting material is paint. In one embodiment, standard wallboard, typically gypsum, comprises the external surfaces of the laminated structure and one or more conductive layers are constructed between the gypsum exterior. In one embodiment, the conducting layer material is selected to provide physical security in addition to radio frequency wave attenuation. The construction is such that acoustical attenuation is also achieved.


Find Patent Forward Citations

Loading…