The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 04, 2011

Filed:

Jul. 29, 2008
Applicants:

Kiyoshi Otsuka, Kariya, JP;

Yasuaki Makino, Okazaki, JP;

Tsuyoshi Fukada, Aichi-gun, JP;

Inao Toyoda, Anjo, JP;

Naoki Kakoiyama, Kariya, JP;

Inventors:

Kiyoshi Otsuka, Kariya, JP;

Yasuaki Makino, Okazaki, JP;

Tsuyoshi Fukada, Aichi-gun, JP;

Inao Toyoda, Anjo, JP;

Naoki Kakoiyama, Kariya, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01L 7/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A pressure sensor includes: a housing having a pressure introduction port; and a connector case integrated with the housing. The connector case includes: a protruding portion that protrudes in the pressure introduction port along with the introduction direction from one end of the connector case, and has a concavity hollowed in a direction perpendicular to the introduction direction; a sensor chip having a pressure gauge on one surface of the chip in the concavity; a terminal having one end inserted and molded in the connector case; and a bonding wire that electrically connects the sensor chip and the one end of the terminal. The connector case seals a connection portion between the bonding wire and the terminal, a connection portion between the boding wire and the sensor chip, and the bonding wire.


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