The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 2011
Filed:
May. 01, 2009
Roger T. Hanley, Great Falls, VA (US);
Robert M. Becker, Centerville, VA (US);
Steven S. Lyons, Herndon, VA (US);
David P. Ramer, Reston, VA (US);
Jonathan A. Robbins, Ashburn, VA (US);
Chad N. Sanders, Ashburn, VA (US);
J. Michael Phipps, Springfield, VA (US);
Roger T. Hanley, Great Falls, VA (US);
Robert M. Becker, Centerville, VA (US);
Steven S. Lyons, Herndon, VA (US);
David P. Ramer, Reston, VA (US);
Jonathan A. Robbins, Ashburn, VA (US);
Chad N. Sanders, Ashburn, VA (US);
J. Michael Phipps, Springfield, VA (US);
ABL IP Holding LLC, Conyers, GA (US);
Abstract
Disclosed exemplary solid state light fixtures use optical cavities to combine or integrate light from LEDs or the like. In such a fixture, the cavity is formed by a light transmissive structure having a volume, and a diffuse reflector that covers a contoured portion of the structure. A heat sink member supports a flexible circuit board so as to position the light emitters to couple light to the transmissive structure and provide effective heat dissipation. The circuit board has flexible tabs mounting the emitters. When installed in the fixture, the tabs bend and the emitters press against a sufficiently rigid periphery of the light transmissive structure. TIM may be compressed between the heat sink member and the opposite surface of each tab. Heat conductive surface pads and heat conductors through vias through the tabs conduct heat from the emitters to the heat sink member, e.g. through the TIM.