The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 27, 2011
Filed:
Jan. 20, 2010
Yuji Masui, Kanagawa, JP;
Takahiro Arakida, Kanagawa, JP;
Kayoko Kikuchi, Kanagawa, JP;
Terukazu Naruse, Kanagawa, JP;
Tomoyuki Oki, Kanagawa, JP;
Naoki Jogan, Kanagawa, JP;
Yuji Masui, Kanagawa, JP;
Takahiro Arakida, Kanagawa, JP;
Kayoko Kikuchi, Kanagawa, JP;
Terukazu Naruse, Kanagawa, JP;
Tomoyuki Oki, Kanagawa, JP;
Naoki Jogan, Kanagawa, JP;
Sony Corporation, Tokyo, JP;
Abstract
The present invention provides a semiconductor device realizing improved adhesion between a low-dielectric-constant material and a semiconductor material. The semiconductor device includes, on a semiconductor layer, an adhesion layer and a low-dielectric-constant material layer in order from the semiconductor layer side. The adhesion layer has a projection/recess structure, and the low-dielectric-constant material layer is formed so as to bury gaps in the projection/recess structure.