The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 27, 2011
Filed:
Jul. 01, 2009
Applicant:
Wen-jyh Sah, Tainan, TW;
Inventor:
Wen-Jyh Sah, Tainan, TW;
Assignee:
Gigno Technology Co., Ltd., Taipei, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor chip module includes a first flip-chip unit and a second flip-chip unit. The first flip-chip unit has a first chip and a first glass circuit board. The first chip is connected with the first glass circuit board by flip-chip bonding. The second flip-chip unit has a second chip and a second glass circuit board. The second chip is connected with the second glass circuit board by flip-chip bonding. The first flip-chip unit and the second flip-chip unit are attached to each other. A method for manufacturing the semiconductor chip module is also disclosed.