The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 27, 2011

Filed:

Dec. 17, 2008
Applicants:

Scott D. Brandenburg, Kokomo, IN (US);

Suresh K. Chengalva, Kokomo, IN (US);

Thomas A. Degenkolb, Noblesville, IN (US);

Inventors:

Scott D. Brandenburg, Kokomo, IN (US);

Suresh K. Chengalva, Kokomo, IN (US);

Thomas A. Degenkolb, Noblesville, IN (US);

Assignee:

Delphi Technologies, Inc., Troy, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/46 (2006.01);
U.S. Cl.
CPC ...
Abstract

An encapsulated microelectronic package includes a fluid conducting cooling tube directly coupled to one or more semiconductor chips, with the encapsulant being molded over the semiconductor chips and portions of the cooling tube in proximity to the semiconductor chips. The encapsulant immobilizes the cooling tube with respect to the semiconductor chips, and the cooling tube and encapsulant are designed to minimize differences in their coefficients of thermal expansion relative to the semiconductor chips.


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