The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 27, 2011

Filed:

Oct. 10, 2008
Applicants:

Katsuyuki Wada, Himeji, JP;

Yasuhisa Nakashima, Himeji, JP;

Inventors:

Katsuyuki Wada, Himeji, JP;

Yasuhisa Nakashima, Himeji, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61L 9/013 (2006.01);
U.S. Cl.
CPC ...
Abstract

An object is to provide a water absorbent resin composition containing a water absorbent resin as a main component, with excellent deodorant property and antimicrobial property without impairing appearance and absorption characteristics of the water absorbent resin. The water absorbent resin composition according to the first aspect includes a water absorbent resin containing a polyacrylic acid (salt)-based water absorbent resin as a main component, and an extract of bamboo and an extract of tea. The water absorbent resin composition according to the second aspect includes a water absorbent resin containing a polyacrylic acid (salt)-based water absorbent resin as a main component, and at least two kinds of compounds selected from a group consisting of hexanoic acid (salt), ethyl butyrate, and 3-methyl-2-cyclopenten-1-one. In addition, the method for producing the water absorbent resin composition according to the third aspect includes the step of adding an alcoholic solution of an extract of bamboo, before or after polymerization of an unsaturated monomer containing an acrylic acid (salt) as a main component.


Find Patent Forward Citations

Loading…