The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 27, 2011
Filed:
Nov. 19, 2008
Jeong-ho Lee, Seoul, KR;
Young-hoon Park, Suwon-si, KR;
Sang-il Jung, Seoul, KR;
Jun-seok Yang, Seongnam-si, KR;
An-chul Shin, Goyang-si, KR;
Min-young Jung, Seoul, KR;
Jeong-Ho Lee, Seoul, KR;
Young-Hoon Park, Suwon-si, KR;
Sang-Il Jung, Seoul, KR;
Jun-Seok Yang, Seongnam-si, KR;
An-Chul Shin, Goyang-si, KR;
Min-Young Jung, Seoul, KR;
Samsung Electronics Co., Ltd., Suwon-Si, KR;
Abstract
A method of fabricating a metal interconnection and a method of fabricating image sensor using the same are provided. The method of fabricating a metal interconnection including forming a interlayer dielectric layer on a substrate, forming an interconnection formation region in the interlayer dielectric layer, performing an ultraviolet (UV) treatment on the substrate after the interconnection formation region is formed and forming a metal interconnection in the interconnection formation region.