The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 27, 2011
Filed:
Mar. 24, 2006
Kiwamu Tokuhisa, Kisarazu, JP;
Kentaro Hayashi, Kisazaru, JP;
Hironobu Kawasato, Kisarazu, JP;
Nippon Steel Chemical Co., Ltd., Tokyo, JP;
Abstract
The present invention relates to a photosensitive resin composition excellent in pliability, ultraviolet sensitivity for development, developability with an aqueous alkali solution, and storage stability at room temperature and a circuit substrate employing the same. The photosensitive resin composition includes a siloxane-containing polyamic acid resin having structural units respectively represented by the following formulae (1), (2), and (3) and a photopolymerization initiator incorporated therein. The circuit substrate is coated with the photosensitive resin composition. In the formulae, Ar represents a residue of an aromatic tetracarboxylic acid; Rrepresents alkyl group having 1 to 6 carbon atoms or phenyl group; Rrepresents alkylene group having 2 to 6 carbon atoms or phenylene group; l represents a number of 0 to 10; Rrepresents a divalent group or a direct bond; Rrepresents —CH═CH—R—, in which Rrepresents a direct bond, alkylene group having 1 to 6 carbon atoms, or phenylene group; Rrepresents a diamine residue; and m, n, and o, indicating the range of the abundant molar ratios of the respective structural units, are 0.3 to 0.95, 0.05 to 0.7, and 0 to 0.5, respectively.