The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2011
Filed:
Aug. 15, 2008
David J. Mitchell, Oviedo, FL (US);
Anand A. Kulkarni, Oviedo, FL (US);
Ramesh Subramanian, Oviedo, FL (US);
Edward R. Roesch, Orlando, FL (US);
Rod Waits, Sunnyvale, CA (US);
Roberto Schupbach, Fayetteville, AR (US);
John R. Fraley, Fayetteville, AR (US);
Alexander B. Lostetter, Fayetteville, AR (US);
Brice Mcpherson, Fayetteville, AR (US);
Bryon Western, West Fork, AR (US);
David J. Mitchell, Oviedo, FL (US);
Anand A. Kulkarni, Oviedo, FL (US);
Ramesh Subramanian, Oviedo, FL (US);
Edward R. Roesch, Orlando, FL (US);
Rod Waits, Sunnyvale, CA (US);
Roberto Schupbach, Fayetteville, AR (US);
John R. Fraley, Fayetteville, AR (US);
Alexander B. Lostetter, Fayetteville, AR (US);
Brice McPherson, Fayetteville, AR (US);
Bryon Western, West Fork, AR (US);
Siemens Energy, Inc., Orlando, FL (US);
Arkansas Power Electronics International, Inc., Fayetteville, AR (US);
Abstract
A circuit assembly () resistant to high-temperature and high g centrifugal force is disclosed. A printed circuit board () is first fabricated from alumina and has conductive traces of said circuit formed thereon by the use of a thick film gold paste. Active and passive components of the circuit assembly are attached to the printed circuit board by means of gold powder diffused under high temperature. Gold wire is used for bonding between the circuit traces and the active components in order to complete the circuit assembly (). Also, a method for manufacturing a circuit assembly resistant to elevated temperature is disclosed.