The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2011
Filed:
Feb. 13, 2009
Applicants:
Chee Soon Law, Melaka, MY;
Fong Lim, Melaka, MY;
Zakaria Abdullah, Melaka, MY;
Inventors:
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor package includes a first semiconductor chip, a second semiconductor chip and a ribbon. The ribbon includes a first metal layer and a second metal layer. The first metal layer is welded to the first chip and the second metal layer is attached to the second chip.
Law, Chee. (2011). Semiconductor package with ribbon with metal layers (U.S. Patent No. 8022558). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8022558
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile