The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2011
Filed:
Jun. 05, 2008
Jin-yong Ahn, Yongin-si, KR;
Chang-sup Ryu, Yongin-si, KR;
Byung-youl Min, Seongnam-si, KR;
Myung-sam Kang, Daejeon, KR;
Jin-Yong Ahn, Yongin-si, KR;
Chang-Sup Ryu, Yongin-si, KR;
Byung-Youl Min, Seongnam-si, KR;
Myung-Sam Kang, Daejeon, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon, KR;
Abstract
A mounting substrate and a method of manufacturing the mounting substrate. The mounting substrate can include an insulation layer, a bonding pad buried in one side of the insulation layer in correspondence with a mounting position of a chip, and a circuit pattern electrically connected to the bonding pad. By utilizing certain embodiments of the invention, the process for stacking a solder resist layer can be omitted, as the bonding pads can be implemented in a form recessed from the surface of the insulation layer. In this way, the manufacturing process can be simplified and manufacturing costs can be reduced. Since the surface of the mounting-substrate on which to mount a chip can be kept flat without any protuberances, the occurrence of voids in the underfill can be minimized. This is correlated to obtaining a high degree of reliability, and leads to a greater likelihood of successful mounting.