The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8022541 B1

PDF
Full Text
Expired
Date of Patent:
Sep. 20, 2011

Filed:

May. 23, 2007
Applicants:

Jong Soo Cho, Seoul, KR;

Yong Jin Park, Gyeonggi-do, KR;

Jeong Tak Moon, Gyeonggi-do, KR;

Eun Kyu Her, Gangwon-do, KR;

Kyu Hwan OH, Seoul, KR;

Inventors:

Jong Soo Cho, Seoul, KR;

Yong Jin Park, Gyeonggi-do, KR;

Jeong Tak Moon, Gyeonggi-do, KR;

Eun Kyu Her, Gangwon-do, KR;

Kyu Hwan Oh, Seoul, KR;

Assignee:

MK Electron Co., Ltd., Yongin, Gyeonngi-Do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

A gold-silver based wire for a semiconductor package has high humidity reliability as well as high dry reliability. The wire includes a first additive ingredient that contains 5˜15 wt % of at least one kind of elements from among first group elements composed of palladium (Pd) and platinum (Pt) added to a gold (Au)-silver (Ag) based alloy that contains 10˜40 wt % of Ag added to Au.


Find Patent Forward Citations

Cho, Jong. (2011). Au-ag based alloy wire for semiconductor package (U.S. Patent No. 8022541). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8022541

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