The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2011
Filed:
Apr. 13, 2010
Yukihiro Satou, Takasaki, JP;
Takeshi Otani, Takasaki, JP;
Hiroyuki Takahashi, Takasaki, JP;
Toshiyuki Hata, Maebashi, JP;
Ichio Shimizu, Tamamura, JP;
Yukihiro Satou, Takasaki, JP;
Takeshi Otani, Takasaki, JP;
Hiroyuki Takahashi, Takasaki, JP;
Toshiyuki Hata, Maebashi, JP;
Ichio Shimizu, Tamamura, JP;
Renesas Electronics Corporation, Kanagawa, JP;
Abstract
A novel semiconductor device high in both heat dissipating property and connection reliability in mounting is to be provided. The semiconductor device comprises a semiconductor chip, a resin sealing member for sealing the semiconductor chip, a first conductive member connected to a first electrode formed on a first main surface of the semiconductor chip, and a second conductive member connected to a second electrode formed on a second main surface opposite to the first main surface of the semiconductor chip, the first conductive member being exposed from a first main surface of the resin sealing member, and the second conductive member being exposed from a second main surface opposite to the first main surface of the resin sealing member and also from side faces of the resin sealing member.