The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2011
Filed:
Aug. 27, 2007
Takanori Aono, Mohka, JP;
Ryoji Okada, Kasumigaura, JP;
Atsushi Kazama, Mohka, JP;
Yoshiaki Takada, Mohka, JP;
Takanori Aono, Mohka, JP;
Ryoji Okada, Kasumigaura, JP;
Atsushi Kazama, Mohka, JP;
Yoshiaki Takada, Mohka, JP;
Hitachi Metals, Ltd., Tokyo, JP;
Abstract
Provided is a semiconductor sensor device which is manufactured by an MEMS technology wherein machining technology and/or material technology is combined with semiconductor technology for detecting and measuring various physical quantities. In the semiconductor sensor device, cracks which generate in a cap chip and a molding resin are eliminated and air-tightness between a semiconductor sensor chip and the cap chip is ensured. The cracks due to vibration applied when being cut can be eliminated by having the circumference side surface of the cap chip as a wet-etched surface. Furthermore, insulation is ensured by coating the cap chip side surface with an insulating protection film.