The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2011
Filed:
Jan. 05, 2007
Applicants:
Yuichi Sawai, Mito, JP;
Osamu Shiono, Hitachi, JP;
Takashi Namekawa, Hitachi, JP;
Hiroyuki Akata, Hitachi, JP;
Takashi Naito, Funabashi, JP;
Keiichi Kanazawa, Ome, JP;
Yuuichi Kijima, Chosei, JP;
Shigemi Hirasawa, Chiba, JP;
Shunichi Asakura, Sakae, JP;
Mitsuo Hayashibara, Hitachinaka, JP;
Inventors:
Yuichi Sawai, Mito, JP;
Osamu Shiono, Hitachi, JP;
Takashi Namekawa, Hitachi, JP;
Hiroyuki Akata, Hitachi, JP;
Takashi Naito, Funabashi, JP;
Keiichi Kanazawa, Ome, JP;
Yuuichi Kijima, Chosei, JP;
Shigemi Hirasawa, Chiba, JP;
Shunichi Asakura, Sakae, JP;
Mitsuo Hayashibara, Hitachinaka, JP;
Assignee:
Hitachi Displays Ltd., Chiba, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C03C 8/02 (2006.01); C03C 8/14 (2006.01); C03C 8/00 (2006.01); C03C 3/12 (2006.01);
U.S. Cl.
CPC ...
Abstract
A bonding glass containing VO: 25 to 50 wt %, TeO: 20 to 40 wt % and BaO: 5 to 30 wt %, and not containing lead.