The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2011
Filed:
Sep. 21, 2009
Oh-jung Kwon, Hopewell Junction, NY (US);
Anthony G. Domenicucci, Hopewell Junction, NY (US);
O Sung Kwon, Hopewell Junction, NY (US);
Jin-woo Choi, Kyeonggi-Do, KR;
Oh-Jung Kwon, Hopewell Junction, NY (US);
Anthony G. Domenicucci, Hopewell Junction, NY (US);
O Sung Kwon, Hopewell Junction, NY (US);
Jin-Woo Choi, Kyeonggi-Do, KR;
International Business Machines Corporation, Armonk, NY (US);
Samsung Electronics Co., Ltd., , KR;
Infineon Technologies AG, Durham, NC (US);
Abstract
A method is provided for forming a metal semiconductor alloy that includes providing a deposition apparatus that includes a platinum source and a nickel source, wherein the platinum source is separate from the nickel source; positioning a substrate having a semiconductor surface in the deposition apparatus; forming a metal alloy on the semiconductor surface, wherein forming the metal alloy comprises a deposition stage in which the platinum source deposits platinum to the semiconductor surface at an initial rate at an initial period that is greater than a final rate at a final period of the deposition stage, and the nickel source deposits nickel to the semiconductor surface; and annealing the metal alloy to react the nickel and platinum with the semiconductor substrate to provide a nickel platinum semiconductor alloy.