The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2011
Filed:
Jan. 30, 2006
Xiwang Qi, Scottsdale, AZ (US);
Rong Fan, Rancho Palos Verdes, CA (US);
Andrew Philip Shapiro, Schenectady, NY (US);
Dacong Weng, Rancho Palos Verdes, CA (US);
Jie Guan, Torrance, CA (US);
James Daniel Power, Santa Monica, CA (US);
Stanley F. Simpson, Rancho Paolo Verdes, CA (US);
Xiwang Qi, Scottsdale, AZ (US);
Rong Fan, Rancho Palos Verdes, CA (US);
Andrew Philip Shapiro, Schenectady, NY (US);
Dacong Weng, Rancho Palos Verdes, CA (US);
Jie Guan, Torrance, CA (US);
James Daniel Power, Santa Monica, CA (US);
Stanley F. Simpson, Rancho Paolo Verdes, CA (US);
General Electric Company, Schenectady, NY (US);
Abstract
A method for manufacturing a solid oxide electrochemical device comprising disposing electrolyte between a first electrode and a second electrode, applying a bonding agent between the first electrode and a first interconnect, applying a sealing agent between the first electrode and the first interconnect, disposing a second interconnect adjacent to the second electrode, heating the first interconnect, the first electrode, the electrolyte, the second electrode, the second interconnect, the bonding agent, and the sealing agent to at least one intermediate temperature for at least one intermediate length of time, and then to a curing temperature, for a curing time, effective to bond and seal the first electrode to the first interconnect, wherein the at least one intermediate temperature is less than the curing temperature.