The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2011
Filed:
Dec. 28, 2007
Takashi Nomura, Toyota, JP;
Mitsuru Sakano, Toyota, JP;
Takashi Nomura, Toyota, JP;
Mitsuru Sakano, Toyota, JP;
Toyota Jidosha Kabushiki Kaisha, Aichi, JP;
Abstract
A plating member comprising a lead-free plating material is obtained by the present invention in a manner such that whisker formation on a plating layerof the plating member can be suppressed and thus the plating member has good solderability. In the case of such plating member having, on the surface of a base material, a plating layercomprising a lead-free material (Sn—Cu alloy, etc.), the plating layerhas a layer structure of two or more layers (ato a), the average particle diameter of plating particles (Pto P) constituting each layer varies from layer to layer, and the plating particle volume fraction of the plating layeris 80% to 90% when the proportion of plating particles occupying a unit volume is defined as a plating particle volume fraction of 100% on the assumption that a unit volumeis filled with plating particles Peach having the maximum average particle diameter.