The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2011
Filed:
Jan. 14, 2010
Takashi Niwa, Chiba, JP;
Susumu Ichihara, Chiba, JP;
Koichiro Jujo, Chiba, JP;
Hiroyuki Hoshina, Chiba, JP;
Takashi Niwa, Chiba, JP;
Susumu Ichihara, Chiba, JP;
Koichiro Jujo, Chiba, JP;
Hiroyuki Hoshina, Chiba, JP;
Seiko Instruments Inc., , JP;
Abstract
To provide an electroforming mold for manufacturing a multi-step structure minute component and a method for manufacturing the same, for which height control is possible and manufacturing process does not become complicated. On the upper face of a film of an electroconductive layerformed on the upper face of a substrate, a resistis formed in which a first soluble portionand a first insoluble portionare formed. Next, a light-absorbing bodyis formed on the upper face of the resist, exposure and development are carried out, in addition a film of an electroconductive layeris formed on the upper face thereof, and a light-absorbing bodyand an electroconductive layeron the upper face of the light-absorbing bodyare removed by liftoff. Further, a resist is formed on the upper face thereof, in which a second soluble portionand a second insoluble portionare formed. Next, the first resist and the second resist are developed to remove the first soluble portionand the second soluble portion, thereby giving an electroforming moldhaving an electroconductive layer on the basal part of respective steps.