The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2011
Filed:
Nov. 18, 2009
Applicants:
Ryo Ota, Hitachi, JP;
Takeyuki Itabashi, Hitachi, JP;
Inventors:
Ryo Ota, Hitachi, JP;
Takeyuki Itabashi, Hitachi, JP;
Assignee:
Hitachi Metals, Ltd., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/14 (2006.01); B23K 31/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
An object of the present invention is to improve a yield of electronic devices in a ball mounting process by preventing a micro-bonding and change in color of the solder balls, and to improve a bonding reliability of the solder balls by reducing an oxide film on a surface of the solder ball. The solder ball has a surface thereof coated with an organic compound containing a cyclic structure and an aliphatic hydrocarbon group.