The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8020570 B1

PDF
Full Text
Expired
Date of Patent:
Sep. 20, 2011

Filed:

Dec. 26, 2007
Applicants:

Takuya Kishimoto, Kyoto, JP;

Katsuhiko Miya, Kyoto, JP;

Inventors:

Takuya Kishimoto, Kyoto, JP;

Katsuhiko Miya, Kyoto, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B08B 3/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

A part of the opening of the nozzle insertion hole located in the liquid discharging direction relative to the nozzle inserted in the nozzle insertion hole is enlarged in the liquid discharging direction. Therefore, the droplets which have migrated to the nozzle insertion hole adheres to the internal surface in the liquid discharging direction relative to the nozzle, that is, to the slanted part via the enlarged part. Moreover, the slanted part is provided slanted from the central portion of the nozzle insertion hole toward the enlarged part and separated away from the central portion of the substrate top surface. Hence, the adhering droplets flow in the liquid discharging direction along the slanted part to be discharged from the opening of the nozzle insertion hole.


Find Patent Forward Citations

Kishimoto, Takuya. (2011). Substrate processing apparatus and substrate processing method (U.S. Patent No. 8020570). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8020570

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