The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 20, 2011

Filed:

Apr. 30, 2010
Applicants:

Rajesh Kumar, Mission Viejo, CA (US);

Monte P. Dreyer, Rancho Santa Margarita, CA (US);

Michael J. Taylor, Longmont, CO (US);

Inventors:

Rajesh Kumar, Mission Viejo, CA (US);

Monte P. Dreyer, Rancho Santa Margarita, CA (US);

Michael J. Taylor, Longmont, CO (US);

Assignee:

DDI Global Corp., Anaheim, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01K 3/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

Methods of manufacturing printed circuit boards using parallel processes to interconnect with subassemblies are provided. In one embodiment, the invention relates to a method of manufacturing a printed circuit board including providing a core subassembly including at least one metal layer, providing a plurality of one-metal layer carriers after parallel processing each of the plurality of one-metal layer carriers, and attaching at least two of the plurality of one-metal layer carriers with each other and with the core subassembly.


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