The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2011
Filed:
Apr. 28, 2008
Ulrich Schaaf, Kaisersbach, DE;
Andreas Kugler, Alfdorf, DE;
Karl-friederich Becker, Berlin, DE;
Alexander Neumann, Rottweil, DE;
Jan Kostelnik, Kirchberg an der Jagst, DE;
Ulrich Schaaf, Kaisersbach, DE;
Andreas Kugler, Alfdorf, DE;
Karl-Friederich Becker, Berlin, DE;
Alexander Neumann, Rottweil, DE;
Jan Kostelnik, Kirchberg an der Jagst, DE;
Robert Bosch GmbH, Stuttgart, DE;
Abstract
In a method for producing an electronic subassembly, at least one electronic component is fixed in place on an insulating layer of a conductive foil in a first step, the conductive foil with the electronic component is laminated onto a circuit board substrate, and a circuit track structure is then developed by structuring the conductive foil. The expansion coefficient of the insulating layer lies between the expansion coefficient of the circuit board substrate and the expansion coefficient of the circuit track structure, and/or electronic components that require small passages for contacting with the circuit track structure are pressed deeper into the insulating layer than electronic components that require larger passages in the insulating layer.