The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2011
Filed:
Dec. 20, 2006
Masafumi Inoue, Saga, JP;
Mitsuhaya Tsukamoto, Fukuoka, JP;
Syoichi Nishi, Fukuoka, JP;
Masahiro Kihara, Fukuoka, JP;
Masafumi Inoue, Saga, JP;
Mitsuhaya Tsukamoto, Fukuoka, JP;
Syoichi Nishi, Fukuoka, JP;
Masahiro Kihara, Fukuoka, JP;
Panasonic Corporation, Osaka, JP;
Abstract
One objective of the present invention is to provide an electronic component mounting system and an electronic component mounting method that can prevent a mounting defect due to a positioning error in the direction of the thickness of a substrate, and that can deliver a specific mounting quality. According to an electronic component mounting system, which is constituted by coupling a plurality of apparatuses used for mounting electronic components, the height measurement deviceof a printing inspection apparatus measures the heights at height measurement points, designated on the upper face of a substrate, and outputs the measurement results as substrate height data. Then, once the substrate has been delivered to an electronic component placing apparatus, the substrate height measurement apparatus again measures the height of the substrate at specific height measurement points to obtain substrate height correction data, and based on the initial substrate height data and the substrate height correction data, updates a control parameter for controlling the component placing operation performed by a loading head. In this manner, discrepancies in the positions of the heights of individual substrates can be accurately corrected, and mounting defects due to positioning errors in the direction of the heights of the substrates can be prevented.