The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2011
Filed:
Aug. 19, 2008
Stephen Richard O'farrell, Balmain, AU;
Jan Waszczuk, Balmain, AU;
Stephen John Sleijpen, Balmain, AU;
James Andrew, Balmain, AU;
Craig Donald Strudwicke, Balmain, AU;
William Granger, Balmain, AU;
Mark Janos, Balmain, AU;
Stephen Richard O'Farrell, Balmain, AU;
Jan Waszczuk, Balmain, AU;
Stephen John Sleijpen, Balmain, AU;
James Andrew, Balmain, AU;
Craig Donald Strudwicke, Balmain, AU;
William Granger, Balmain, AU;
Mark Janos, Balmain, AU;
Silverbrook Research Pty Ltd, Balmain, New South Wales, AU;
Abstract
The present invention relates to a bonding device for bonding a flexible printed circuit board (PCB) to a printhead assembly. The printhead assembly includes a printhead carrier and an ink ejection printhead carried by the carrier. The bonding device includes a support structure assembly and a first heater assembly arranged on the support structure assembly to be movable along a first path and configured to bond the flexible PCB to the printhead. A bending mechanism is arranged on the support structure and is configured to bend the bonded PCB. A second heater assembly is arranged on the support structure assembly to be movable along a second path and is configured to bond the bent PCB to the printhead carrier. A control system controls operation of the heater assemblies and the bending mechanism.