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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8018057 B1

PDFFull Text
Expired
Date of Patent:
Sep. 13, 2011

Filed:

Feb. 20, 2008

Semiconductor device with resin layers and wirings and method for manufacturing the same

Applicant:

Tatsuhiko Asakawa, Fujimi, JP;

Inventor:

Tatsuhiko Asakawa, Fujimi, JP;

Assignee:

Seiko Epson Corporation, , JP;

Attorney:

Harness, Dickey & Pierce, P.L.C.

Primary Examiner:

Minh-Loan T Tran

Assistant Examiner:

Teresa M Arroyo

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 23/58 (2006.01); H01L 23/12 (2006.01); H01L 23/053 (2006.01); H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device includes: a semiconductor substrate that has an integrated circuit and an electrode electrically connected to the integrated circuit; a first resin layer that is formed in a first region overlapping the integrated circuit over a surface of the semiconductor substrate where the electrode is formed; a wiring that is electrically connected to the electrode and is formed on the first resin layer; and a second resin layer that is formed on the surface of the semiconductor substrate in a second region surrounding the first region, is the second resin layer being spaced a distance from the first resin layer.

Find Patent Forward Citations

Asakawa, Tatsuhiko. (2011). Semiconductor device with resin layers and wirings and method for manufacturing the same (U.S. Patent No. 8018057). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8018057

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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