The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 2011
Filed:
Jun. 10, 2008
Yoshinobu Suehiro, Aichi-ken, JP;
Masayoshi Ichikawa, Aichi-ken, JP;
Satoshi Wada, Aichi-ken, JP;
Koji Tasumi, Aichi-ken, JP;
Yoshinobu Suehiro, Aichi-ken, JP;
Masayoshi Ichikawa, Aichi-ken, JP;
Satoshi Wada, Aichi-ken, JP;
Koji Tasumi, Aichi-ken, JP;
Toyoda Gosei Co., Ltd., Nishikasugai-gun, Aichi-ken, JP;
Abstract
A solid-state device having: a flip-chip mounted solid-state element; a power receiving/feeding portion having a mounting substrate to allow that a mounting surface of the solid-state element forms substantially the same plane as a surface of the mounting substrate; and an inorganic sealing portion made of an inorganic sealing material having a thermal expansion coefficient equal to that of the power receiving/feeding portion for sealing the solid-state element.