The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 2011
Filed:
Jan. 18, 2007
Yutaka Akiba, Hitachi, JP;
Hiroki Kaneko, Hitachinaka, JP;
Ikuo Hiyama, Hitachinaka, JP;
Toshiaki Tanaka, Hitachi, JP;
Yutaka Akiba, Hitachi, JP;
Hiroki Kaneko, Hitachinaka, JP;
Ikuo Hiyama, Hitachinaka, JP;
Toshiaki Tanaka, Hitachi, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A widely applicable and low cost module substrate with a high accuracy, reliability and heat-radiation structure. A light source includes: a heat radiation substrate; an insulating layer formed in some regions in an upper surface of the substrate; a wiring layer having wiring patterns, the wiring layer being arranged on the insulating layer; and a plurality of LED elements connected to the wiring layer. Moreover, the light source includes: a heat radiation substrate; an insulating layer arranged in some regions in an upper surface of the substrate; a wiring layer having wiring patterns, the wiring layer being arranged on the insulating layer; and LED elements connected to the wiring layer, wherein the insulating layer has two layers of a resin layer arranged in the wiring layer side and an adhesive layer arranged in the heat radiation substrate side.