The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 2011
Filed:
Jul. 08, 2005
Masateru Ichikawa, Toda, JP;
Kunihiro Naoe, Tokyo, JP;
Shoji Ajimura, Oiso-machi, JP;
Fujikura Ltd., Tokyo, JP;
Abstract
In a terminal portion having a copper or a copper alloy wiring according to one embodiment, the terminal portion being of a flexible print circuit board or a flexible flat cable and for connecter-fitting to a connector by being pressed by a connector pin, the copper or the copper alloy wiring having a pure tin or a lead-free tin alloy plating layer formed thereon is thermally treated so as to form an inter-metal compound including copper and tin on the copper or the copper alloy wiring, and a remaining thickness of the pure tin or the lead-free tin alloy plating layer is from 0.2 μm to 1.6 μm, wherein as an initial plating layer, a thickness of the pure tin or the lead-free tin alloy plating layer formed on the copper or the copper alloy wiring is from 1.5 μm to 5.0 μm, and a thickness of the inter-metal compound including copper and tin is from 0.1 μm to 3.5 μm.