The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8017874 B1

PDF
Full Text
Expired
Date of Patent:
Sep. 13, 2011

Filed:

Feb. 19, 2009
Applicants:

Mitsuru Honjo, Ibaraki, JP;

Katsutoshi Kamei, Ibaraki, JP;

Inventors:

Mitsuru Honjo, Ibaraki, JP;

Katsutoshi Kamei, Ibaraki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A first insulating layer is formed on a suspension body, and a write wiring trace is formed on the first insulating layer. A second insulating layer is formed on the first insulating layer so as to cover the wiring trace. A write wiring trace is formed, above the write wiring trace, on the second insulating layer. A ground trace is formed on one side of the write wiring trace at a distance on the second insulating layer. A third insulating layer is formed on the second insulating layer so as to cover the wiring trace and the ground trace. An opening is formed in a region, below the write wiring trace, of the suspension body.


Find Patent Forward Citations

Honjo, Mitsuru. (2011). Multi-layered printed circuit board with a conductive substrate and three insulating layers with wiring and ground traces (U.S. Patent No. 8017874). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8017874

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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