The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 13, 2011

Filed:

Nov. 20, 2007
Applicants:

Hiroyoshi Kaito, Tokyo, JP;

Takashi Kurata, Tokyo, JP;

Toshiyuki Higashijima, Tokyo, JP;

Inventors:

Hiroyoshi Kaito, Tokyo, JP;

Takashi Kurata, Tokyo, JP;

Toshiyuki Higashijima, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08F 8/00 (2006.01); C08L 9/00 (2006.01); C08L 23/00 (2006.01); C08L 25/02 (2006.01); B05D 1/36 (2006.01);
U.S. Cl.
CPC ...
Abstract

A resin composition for metal plating provides a molded article exhibiting excellent metal plating adhesion strength and chemical resistance, while having excellent productivity. A metal-plated molded article can also be made from such a resin composition. The resin composition for metal plating includes 50-90% by mass of Component (A) and 10-50% by mass of Component (B), the total of Component (A) and Component (B) being 100% by mass, wherein Component (A) is a polypropylene resin, and Component (B) is a rubber-reinforced vinyl resin obtained by polymerizing a vinyl monomer in the presence of a rubber-like polymer, or a mixture of the rubber-reinforced vinyl resin and a (co)polymer of the vinyl monomer. The composition may further include 0.5-30 parts by mass of a compatibilizer (C) per 100 parts by mass of the total of Component (A) and Component (B). Component (B) is preferably a non-diene rubber-reinforced resin.


Find Patent Forward Citations

Loading…